Description
Please read:
Second-hand product.The origin is sent randomly with a one-year warranty.Due to the production process, the surface of the product is not 100% smooth and may be accompanied by scratches.
Intel Core i5-6500 specifications
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Desktop |
| Family | Intel Core i5 |
| Model number ? | i5-6500 |
| CPU part numbers |
- CM8066201920404 is an OEM/tray microprocessor
- BX80662I56500 is a boxed processor with fan and heatsink (English version)
- BXC80662I56500 is a boxed processor with fan and heatsink (Chinese version)
| Frequency ? | 3200 MHz | |||
| Maximum turbo frequency | 3600 MHz (1 core) | 3500 MHz (2 cores) | 3400 MHz (3 cores) | 3300 MHz (4 cores) |
| Bus speed ? | 8 GT/s DMI | |||
| Clock multiplier ? | 32 | |||
| Package | 1151-land Flip-Chip Land Grid Array | |||
| Socket | Socket 1151 / H4 / LGA1151 | |||
| Size | 1.48″ x 1.48″ / 3.75cm x 3.75cm | |||
| Introduction date | September 1, 2015 (announcement) | September 1, 2015 (availability in Asia) | September 27, 2015 (availability elsewhere) | |
| Price at introduction | $192 (OEM) | $202 (box) | ||
| S-spec numbers | ||||
| Part number | ES/QS processors | Production processors | ||
| QJEF | SR2BX | SR2L6 | ||
| BX80662I56500 | + | + | ||
| BXC80662I56500 | + | + | ||
| CM8066201920404 | + | + | ||
| Unknown | + | |||
| Architecture / Microarchitecture | ||||
| Microarchitecture | Skylake | |||
| Processor core ? | Skylake-S | |||
| Core stepping ? | R0 (SR2BX, SR2L6) | |||
| CPUID | 506E3 (SR2BX, SR2L6) | |||
| Manufacturing process | 0.014 micron | |||
| Data width | 64 bit | |||
| The number of CPU cores | 4 | |||
| The number of threads | 4 | |||
| Floating Point Unit | Integrated | |||
| Level 1 cache size ? | 4 x 32 KB 8-way set associative instruction caches | 4 x 32 KB 8-way set associative data caches | ||
| Level 2 cache size ? | 4 x 256 KB 4-way set associative caches | |||
| Level 3 cache size | 6 MB 12-way set associative shared cache | |||
| Physical memory | 64 GB | |||
| Multiprocessing | Uniprocessor | |||
| Extensions and Technologies |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
- AES / Advanced Encryption Standard instructions
- AVX / Advanced Vector Extensions
- AVX2 / Advanced Vector Extensions 2.0
- BMI / BMI1 + BMI2 / Bit Manipulation instructions
- F16C / 16-bit Floating-Point conversion instructions
- FMA3 / 3-operand Fused Multiply-Add instructions
- EM64T / Extended Memory 64 technology / Intel 64 ?
- NX / XD / Execute disable bit ?
- VT-x / Virtualization technology ?
- VT-d / Virtualization for directed I/O
- TBT 2.0 / Turbo Boost technology 2.0 ?
- TXT / Trusted Execution technology
- TSX / Transactional Synchronization Extensions
- MPX / Memory Protection Extensions
- SGX / Software Guard Extensions
- SMAP / Supervisor Mode Access Prevention
- SMEP / Secure Mode Execution Protection
| Low power features | Enhanced SpeedStep technology ? | |||||
| Integrated peripherals / components | ||||||
| Display controller | 3 displays | |||||
| Integrated graphics | GPU Type: HD 530 | Graphics tier: GT2 | Microarchitecture: Gen 9 | Execution units: 24 | Base frequency (MHz): 350 | Maximum frequency (MHz): 1050 |
| Memory controller | The number of controllers: 1 | Memory channels: 2 | Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133 | DIMMs per channel: 2 | Maximum memory bandwidth (GB/s): 34.1 | |
| Other peripherals |
- Direct Media Interface 3.0
- PCI Express 3.0 interface (16 lanes)
| Electrical / Thermal parameters | |
| Thermal Design Power ? | 65 Watt |
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